IDC-SFLOW^® Wall Outlet Type Air Conditioning Systems

• IDC-SFLOW^®*1 deploys a wall outlet type through which cool air is supplied directly into server rooms from the partition walls with the air conditioning equipment room.
• This allows for up to a two-thirds reduction in the blowing power of the system’s air conditioners compared to normal systems with floor vents.
• The rectification mechanism for the air supply to cold aisles ensures a stable supply of cold air to rack suction inlets in pursuit of uniform rack suction temperatures.
• The system prevents heat spots from forming and can also be used to cool high-load racks.

IDC-SFLOW^®: Internet Data Center Side Flow System

1. Jointly developed with Kanden Energy Solution Co., Inc.

Patent No. 5743536, Patent No. 5748469,
Patent No. 5926030, Patent No. 6049981,
Patent No. 6117500,
Patent No. 102538161 (China), etc.

• Blowing power: 1/3 of floor-vent systems (Takasago Thermal Engineering’s estimate)
• Rack suction temperature variation: 1/4 of floor-vent systems due to rectification mechanism
• Cooling capacity per rack: Average of 6 kW/rack (locally, up to 17 kW/rack possible)
• Underfloor space: Not necessary for air conditioning
• PUE: Highest in Japan (up to 1.2) achievable by pairing with outside air-based cooling

Relevant Links

Takasago Thermal Engineering’s Energy-Saving Air Conditioning System for Data Centers and Server Rooms Receives Jury Special Award at the Green IT Award 2012 (261 KB)

Takasago Thermal Engineering Wins Minister of the Environment Award for Collaborative Technology Development on the Fundamental Low-Carbon Operation of Data Centers and Waste Heat Use in Offices (364 KB)